Processing-using-DRAM interference; atomic-scale plasma processing; gallium oxide phase instability; event-driven reinforcement learning for fab control; microarchitectural timing leaks in embedded processors; LLM-assisted RTL generation; TPU training supercomputers. The post Chip Industry Technical Paper Roundup: June 30 appeared first on Semiconductor Engineering .

Source: Semiconductor Engineering — read the full report at the original publisher.

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