Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage devices without the limitations of traditional NAND packaging to deliver higher capacity using less dense 3D NAND dies.

Source: Tom's Hardware — read the full report at the original publisher.

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