Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer

Imec, ASML, and TSMC have integrated both n-type and p-type transistors with atomically thin 2D channels on a single 300mm wafer.

Source: Tom's Hardware — read the full report at the original publisher.

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