Researchers from imec and KU Leuven have published “DTCO of NOR-Type IGZO FeFETs for 3D Heterogeneous AI Memories: A Read-Centric Perspective”. Abstract excerpt “This work evaluates the viability of NOR-type IGZO FeFETs for 3D heterogeneous AI memories from a read-centric design-technology co-optimization (DTCO) perspective, spanning on-chip back-end-of-line (BEOL) RAMs and hybrid-bonded memory chiplets, and off-chip,... » read more The post Read-Centric DTCO for IGZO FeFETs 3D Heterogeneous AI memories (imec, KU Leuven) appeared first on Semiconductor Engineering .
Source: Semiconductor Engineering — read the full report at the original publisher.