Researchers from Université Grenoble Alpes, CNRS, Grenoble INP have released “Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems”. Abstract “Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and performance, they also introduce... » read more The post Side-Channel Risks Across Advanced Chiplet Packages (UGA, CNRS) appeared first on Semiconductor Engineering .
Source: Semiconductor Engineering — read the full report at the original publisher.