Enhances heat dissipation by integrating ICEs into the HBM package SEOUL, South Korea, May 26, 2026 — SK hynix Inc. has announced the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth memory(HBM) package for next-generation HBM products. Heat management has become a critical challenge as HBM technology advances with higher […] The post SK hynix Unveils ‘iHBM’ Thermal Solution to Boost AI Performance appeared first on HPCwire .
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