SUNNYVALE, Calif., June 17, 2026 — Synopsys, Inc. today announced availability of its first Multiphysics Fusion solutions for customer deployment. As chip complexity increases, physics-related challenges including signal integrity, power integrity, thermal integrity, electromagnetic effects, and co-packaged optics are becoming critical constraints at advanced nodes and in multi-die architectures, requiring a unified EDA and multiphysics […] The post Synopsys Launches Multiphysics Fusion Portfolio for AI and HPC Chip Design appeared first on HPCwire .
Source: HPCwire — read the full report at the original publisher.