FOSTER CITY, Calif., June 2, 2026 – ZutaCore, a leader in waterless, direct-to-chip, two-phase liquid cooling, today announced its $100 million Series C funding round. The round includes investment from Mitsubishi Electric, Carrier Ventures, and Samsung Electronics (via its CVC arm, Samsung Ventures), alongside additional investors. The funding supports global commercialization expansion as ZutaCore scales […] The post ZutaCore Raises $100M Series C to Scale Waterless Cooling for AI and HPC Data Centers appeared first on HPCwire .
Source: HPCwire — read the full report at the original publisher.