Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint
Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage devices without the limitations of traditional NAND packaging to deliver higher capacity using less dense 3D NAND dies.
Ongoing geopolitical tensions and US sanctions are compelling Chinese firms like Huawei to innovate domestically to overcome restrictions on critical technology access.
This innovation demonstrates a significant step in sidestepping sanctions, allowing Huawei to produce high-capacity storage components despite limitations on advanced 3D NAND chips, impacting global semiconductor supply chains.
Huawei can now engineer high-density SSDs using less advanced NAND technology, fostering greater self-sufficiency in critical hardware components and potentially impacting chip export controls effectiveness.
- · Huawei
- · Chinese technology sector
- · PC components market (China)
- · US semiconductor manufacturers
- · Companies dependent on US sanctions
- · Traditional NAND packaging industry
Huawei gains a domestic solution for high-capacity storage, reducing reliance on foreign suppliers.
This development could spur further innovation in packaging technologies to circumvent other semiconductor restrictions, challenging existing technology dominance.
It might lead to a bifurcated global tech ecosystem, with distinct supply chains and technological standards emerging in different geopolitical blocs.
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