New platform delivers direct-to-chip liquid cooling with end-to-end infrastructure and services, simplifying enterprise deployment of high-density AI compute AUSTIN, Texas, June 26, 2026 — JetCool, a Flex company and leading provider of advanced cooling for AI and high-density computing, has announced the launch of a liquid-cooled version of the Dell PowerEdge XE7745 server. The solution […] The post JetCool Brings Direct-to-Chip Liquid Cooling to Dell PowerEdge XE7745 appeared first on HPCwire .
The accelerating demand for high-density AI compute is pushing the limits of traditional air cooling, making advanced liquid cooling solutions essential for performance and efficiency.
This development addresses a critical physical bottleneck in scaling AI infrastructure, enabling denser, more powerful compute installations necessary for training and deploying large AI models.
The availability of integrated direct-to-chip liquid cooling for a major server platform simplifies deployment of high-density AI, moving it from specialized projects to a more mainstream enterprise offering.
- · JetCool
- · Dell
- · AI compute infrastructure providers
- · Enterprises deploying AI at scale
- · Traditional air-cooling solutions
- · Data centers without liquid cooling infrastructure
Increased thermal envelopes for AI chips enable more powerful and efficient processors to be integrated into standard server form factors.
The widespread adoption of liquid cooling changes data center design and energy consumption patterns, potentially impacting real estate and utility requirements.
Improved efficiency and density in AI compute accelerates the development and deployment of more sophisticated AI applications across various industries, creating new market opportunities and competitive pressures.
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