Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency SEOUL, South Korea, June 18, 2026 — SK hynix Inc. has announced that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers. “The company was able to deliver samples of the 12-stack HBM4E on schedule […] The post SK hynix Ships 12-Stack HBM4E Samples to Major AI Customers appeared first on HPCwire .
The rapid expansion of AI foundational models and inference workloads is driving an unprecedented demand for higher performance memory solutions, pushing HBM development cycles.
Advanced memory like HBM4E is a critical bottleneck for AI compute; its availability and performance directly impact the scaling and efficiency of future AI systems.
The availability of 12-stack HBM4E samples indicates a key component for next-generation AI accelerators is maturing, enabling more powerful and compact AI hardware designs.
- · SK hynix
- · Major AI customers (e.g., NVIDIA, Intel, AMD)
- · AI hardware developers
- · Cloud AI service providers
- · Competitors with less advanced HBM offerings
- · AI service providers reliant on older, less efficient memory solutions
Increased performance and efficiency for AI accelerators and data center infrastructure.
Accelerated development and deployment of more complex and multimodal AI models, reducing training and inference costs per unit of compute.
Further concentration of AI compute advantage towards entities capable of integrating and optimizing these leading-edge memory technologies.
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